SENSOFARユーザー論文
SENSOFARユーザー論文
Study of wear particles formation at single asperity contact: An experimental and numerical approach
M.A. Mekicha, M.B. de Rooij, T. Mishra, D.T.A. Matthews, L. Jacobs, D.J. Schipper, - Wear s 470?471 203644
Zhangwei Ma,Zhifeng Wang,Huanhuan Liu,Fufei Pang,Zhenyi Chen,Tingyun Wang - Optical Fiber Technology
Kamil Leksycki, Eugene Feldshtein, Rados?aw W. Maruda, Navneet Khanna, Grzegorz M. Kr?lczyk, Catalin I. Pruncu, - Tribology International 170 107504
Mattia Bellotti, Jos? Ram?n De Eguilior Caballero, Jun Qian, Dominiek Reynaerts, - Journal of Materials Processing Technology 288 116852
Armen Tchobanian, Frederik Ceyssens, Mar C?ndor Salgado, Hans Van Oosterwyck, Pedro Fardim, - Carbohydrate Polymers 252 117183
Eneko S?enz de Argando?a, Alaitz Zabala, Lander Galdos, Joseba Mendiguren, - Procedia Manufacturing 47 Pages 591-595
Marco Sorgato, Rachele Bertolini, Stefania Bruschi, - Journal of Manufacturing Processes 50 Pages 547-560
Junghyo Yoon, Eundoo Lee, Jaehoon Kim, Sewoon Han, Seok Chung - Biosensors and Bioelectronics Volume 92, 15 June 2017, Pages 465-471
Sergiy Rogalsky, Jean-Fran?ois Bardeau, Lyudmila Lyoshina, Oksana Tarasyuk, Olga Bulko, Oleg Dzhuzha, Tetiana Cherniavska, Valeriy Kremenitsky, Larisa Kobrina, Sergii Riabov, - Materials Chemistry and Physics 267 124682
Mar?a J.G. Guimarey, Jos? M. Li?eira del R?o, Josefa Fern?ndez, - Journal of Molecular Liquids 350 118550
Quanli Zhang, Qiwen Wang, Zhen Zhang, Honghua Su, Yucan Fu, Jiuhua Xu, - Materials Science in Semiconductor Processing 107 104864
Viviane St?ndert, Kai Borcherding, Nicole Bormann, Gerhard Schmidmaier, Ingo Grunwald, Britt Wildemann, - Bioactive Materials 6 Issue 8 Pages 2331-2345
M.P. Shisode, J. Hazrati, T. Mishra, M.B. de Rooij, A.H. van den Boogaard, - Tribology International 146 106182
M?ria Mihalikov?, Anna Li?kov?, Alexandra Koval??kov?, J?n Miche? - Materials Today: Proceedings Volume 3, Issue 4, 2016, Pages 1064-1068
Jos? Divo Bressan, Qiaoling Wang, Enrico Simonetto, Andrea Ghiotti, Stefania Bruschi - International Journal of Material Forming
